STATIC CONTROL PRODUCTS AND PRECISION HANDTOOLS

INTRODUCTION TO ESD

Static electricity has been an industrial problem for centuries. As early as the 1400's, European forts were using static control procedures and devices to prevent electrostatic discharge igniting gunpowders and other explosives.

Today Electro Static Discharge (ESD) impacts productivity and product reliability in virtually every aspect of today's electronics environment.

Damage to this industry has been estimated to running into billions of dollars annually.

CATASTROPHIC FAILURE, TOTAL FAILURE OF CIRCUIT

ESD can change the characteristics of a semiconductor device, degrading or destroying it. Controlling ESD begins with understanding how electrostatic discharge occurs in the first place. Electrostatic charge is most commonly created by the contact or separation of two materials. This is known as 'triboelectric charging', it involves the transfer of electrons between materials.

Electrostatic damage to electronics devices can occur at any point from manufacture to field service. Damage results from handling the devices in uncontrolled surroundings or when poor ESD control practices are used. Generally damage is classified as either a catastrophic failure or a latent defect.

CIRCUIT DAMAGE

Catastrophic Failure. When an electronic devices exposed to an ESD event it may have caused a metal melt, junction failure or oxide breakdown, permanently damaging it's circuitry and resulting in failure. Such failure can usually be detected when the devices are tested before shipping. If the ESD event occurs after the test the damage will go undetected until the device fails in operation.

SHORT CIRCUIT, MALFUNCTION IN CIRCUIT

Latent Damage. A latent defect is much more difficult to identify. A device may be partially degraded yet continue to perform its intended function. However, the operating life of the device maybe reduced dramatically. This could cause premature system failure which could prove extremely hazardous and very costly.